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Our precision-engineered telecentric macro lenses deliver zero-distortion, high-contrast imaging critical for reliable automated optical inspection of printed circuit boards.
35mm Sensor Bi-Telecentric Lens for PCB Defect Detection — High Resolution, China Factory
MT Series 1.1-Inch Telecentric Lens for PCB Inspection — High Precision Measurement Solutions
High-Resolution 12K Telecentric Lens for PCB AOI Systems — Area & Line Scan Cameras
Telecentric Lens MT Series 1.1 for PCB Quality Control — High Precision Measurement
In today's hyper-competitive electronics manufacturing industry, the integrity of every printed circuit board (PCB) is non-negotiable. Even a single microscopic solder bridge, a misaligned component, or an incomplete via can result in catastrophic device failure, costly product recalls, or irreparable brand damage. This is precisely why telecentric macro lenses for PCB defect detection have become a cornerstone technology in modern automated optical inspection (AOI) systems.
Unlike conventional lenses that produce perspective distortion — causing objects at different distances to appear at different magnifications — telecentric lenses maintain a constant magnification regardless of object depth. This unique optical property eliminates parallax errors and ensures that dimensional measurements derived from captured images are absolutely accurate. For PCB inspection, where component tolerances are measured in microns, this distinction is not just technical; it is commercially decisive.
The global PCB market is projected to exceed $100 billion by 2030, driven by surging demand from 5G telecommunications, electric vehicles, consumer electronics, and industrial automation. With production volumes scaling to hundreds of thousands of boards per day at leading facilities, manual inspection has become physically impossible and economically unviable. Automated optical inspection systems equipped with high-performance telecentric macro lenses now serve as the standard bearer for quality assurance on modern PCB production lines worldwide.
Major electronics manufacturers — including Tier-1 suppliers to Samsung, Apple, LG, Huawei, and TSMC — have adopted telecentric AOI optics as a baseline requirement. The lens specifications written into procurement contracts increasingly demand bi-telecentric designs, sub-micron distortion control, and compatibility with 12K line-scan or high-resolution area-scan sensors. This commercial reality reflects the degree to which precision optics have moved from a differentiating feature to a table-stakes standard in advanced electronics manufacturing.
A telecentric macro lens for PCB defect detection delivers several fundamental advantages that conventional or standard machine-vision lenses simply cannot match:
Bi-telecentric designs ensure all rays are parallel both on the object and image sides, completely eliminating perspective and parallax errors — essential for measuring solder joint geometry and pad dimensions.
Even as component height varies across a PCB surface, magnification remains perfectly stable, enabling algorithms to compare features across the entire board without recalibration or depth compensation.
Optimized for 12K line-scan and high-resolution area-scan sensors, telecentric macro lenses resolve fine-pitch BGA pads, QFN leads, and micro-via structures down to sub-5µm feature sizes.
Engineered illumination compatibility ensures maximum contrast for solder inspection, while extended depth of field captures warped or non-planar boards without loss of sharpness at edges.
With distortion rates below 0.05%, these lenses enable real-time in-line dimensional metrology — verifying component placement tolerances, solder volume, and trace widths as production runs.
Available in configurations for 2/3", 1", 1.1", and 35mm sensors, Canrill telecentric lenses integrate seamlessly with industry-standard camera platforms from leading machine vision vendors.
Bi-telecentric lenses — where both the object-side and image-side chief rays are parallel to the optical axis — represent the gold standard for PCB inspection optics. By eliminating shading effects and ensuring uniform illumination response across the full field of view, bi-telecentric designs allow 2D and 3D AOI systems to detect sub-pixel defects such as micro-cracks in solder joints, lifted leads on fine-pitch ICs, and coplanarity deviations in BGA arrays with unprecedented reliability and throughput.
Telecentric macro lenses serve a diverse range of critical inspection tasks across the PCB manufacturing lifecycle — from bare board verification to final assembly validation.
Before component placement, solder paste must be deposited with precise volume and positioning on each pad. Telecentric lenses in SPI systems measure paste height, area, and volume with 3D reconstruction algorithms. The constant magnification property is critical here: even slight variations in stencil standoff height do not affect the calculated dimensions. Inline SPI with telecentric optics reduces solder-related defects at subsequent reflow stages by up to 60%, directly improving first-pass yield.
This is the most demanding application. After reflow soldering, every joint must be verified for wetting angle, fillet shape, bridging, tombstoning, and solder balls. Telecentric macro lenses operating at high magnification capture sufficient detail to distinguish acceptable meniscus profiles from defective joints — a task that requires both optical resolution and geometric accuracy simultaneously. High-brightness telecentric lens designs further enhance contrast between metallic solder surfaces and FR4 substrate, enabling robust edge detection even on shiny, specular surfaces.
While X-ray is the primary modality for BGA joint inspection beneath the package, surface-level telecentric imaging captures alignment shift, package rotation, and ball protrusion at the perimeter — providing complementary data for predictive defect modeling. As package pitches shrink toward 0.3mm and below in advanced mobile and HPC applications, the resolution ceiling of the telecentric lens becomes a direct driver of inspection capability.
QFP packages with 0.4mm pitch, QFN components with near-zero lead exposure, and micro-BGAs with 0.2mm ball pitch all demand telecentric imaging to verify placement accuracy. Machine vision systems using 12K line-scan cameras paired with telecentric lenses achieve throughput exceeding 3 meters per second while maintaining measurement uncertainty below 2µm — enabling 100% inline inspection at production-speed without sampling compromises.
Before component assembly begins, bare PCBs must be verified for trace width and spacing, pad size, hole registration, and surface finish integrity. Telecentric lenses with large field-of-view configurations scan entire panel sections in a single pass, comparing captured dimensions against Gerber data with sub-pixel accuracy. This stage is particularly important for HDI (High-Density Interconnect) boards used in smartphones and wearables, where trace widths of 50µm or less demand the very finest optical resolution.
Post-assembly, many PCBs receive conformal coatings for environmental protection. Telecentric lenses combined with UV fluorescence illumination verify coating coverage, detect voids, and measure film thickness uniformity — critical for automotive electronics, aerospace avionics, and industrial control boards that must meet IPC-CC-830 or MIL-I-46058 standards.
The convergence of AI-driven image analysis, multi-modal inspection, and next-generation sensor platforms is reshaping telecentric lens requirements for the coming decade.
Deep learning models trained on millions of labeled defect images are replacing rule-based AOI algorithms. These neural networks demand higher-quality, lower-noise input images — pushing lens specifications toward higher MTF, reduced chromatic aberration, and more uniform field illumination. Telecentric lens manufacturers are collaborating directly with AI inspection software developers to co-optimize optical and algorithmic parameters.
Next-generation inspection systems combine 2D telecentric imaging with structured light or laser triangulation for full 3D topographic analysis of solder joints and component seating. This requires telecentric lenses with precisely characterized depth-response characteristics and minimal wavefront aberration, enabling accurate point-cloud reconstruction at production speeds.
Manufacturers are shifting from end-of-line sampling inspection to 100% inline verification at every process stage. This trend drives demand for higher-throughput telecentric optical systems capable of operating in vibration-prone factory environments without compromising sub-micron measurement accuracy, leading to more robust opto-mechanical designs with active vibration compensation.
As camera manufacturers release 35mm full-frame and larger sensors with 100+ megapixel resolutions, telecentric lens design must scale accordingly. Canrill's bi-telecentric lenses for 35mm sensors represent the leading edge of this trend, enabling single-shot inspection of larger board areas without stitching artifacts or field-edge distortion — a critical capability for panel-level inspection of server motherboards and automotive ECUs.
Battery management systems, inverter PCBs, and ADAS control units in electric vehicles demand inspection standards that far exceed consumer electronics norms. Telecentric lenses for EV PCB inspection must handle large-format substrates with thick copper traces, press-fit connectors, and heavy-gauge SMT components — creating new design challenges for working distance, depth of field, and illumination architecture.
The blurring boundary between PCB and semiconductor packaging — through technologies like embedded die, fan-out wafer-level packaging, and 2.5D/3D IC integration — is extending telecentric inspection into new territories. Features sizes on advanced substrates now overlap with wafer-level metrology requirements, driving demand for telecentric lenses with semiconductor-grade resolution combined with the robust mechanical design suitable for factory environments.
From manufacturing to creation, we are on the way — building the world's leading telecentric lens solutions for PCB inspection and beyond.
"Our objective is to produce a top-level lens and become one of the leaders in telecentric technology."
Canrill Optics, established in 2009, is the first company in China to focus exclusively on the manufacturing and marketing of telecentric lenses and telecentric lens design. More distinctively, Canrill is the only manufacturer in the world to have built a complete, vertically-integrated supply chain encompassing both its own mechanical factory and optical factory dedicated to industrial lens production.
Over the years, as a custom lens manufacturer, Canrill lenses have been upgraded through four generations of technology and performance improvement. This relentless innovation has earned the trust of clients worldwide, and has enabled successful partnerships with globally recognized brands including Samsung, Apple, LG, Huawei, Han's Laser, and TSMC.
From manufacturing to creation, we are on the way.
Since founding Canrill in 2009, Simon has been focused on building the world-leading manufacturer of telecentric lenses. Under Simon's leadership, Canrill has grown into a 100+ person company renowned in both China and overseas.
Senior optical designer with 10+ years of experience in the design and inspection of telecentric lenses and lighting systems for machine vision applications.
15+ years of experience in precision mechanical design for industrial optical instruments, ensuring Canrill lenses meet the highest standards of structural integrity and thermal stability.
Canrill ISO 9001
Lens Cone RoHS Certificate 1
Lens Cone RoHS Certificate 2
Lens Cone RoHS Certificate 3
Lens Cone RoHS Certificate
Explore our full range of precision telecentric and bi-telecentric macro lenses — designed and manufactured in China for global AOI, SPI, and PCB defect detection systems.
35mm Sensor Bi-Telecentric Lens for PCB AOI — High Resolution China Factory
MT Series 1.1-Inch Telecentric Lens for PCB Measurement — High Precision Solutions
12K High-Resolution Telecentric Lens for PCB Line Scan Inspection
MT Series 1.1 Telecentric Lens for PCB Quality Control — China Suppliers
Telecentric Lens for 2D AOI PCB Defect Detection — High Precision Optical Solution
12K Line Scan (62mm) Telecentric Lens for PCB Surface Inspection
5MDT Series Bi-Telecentric Lens for PCB & Semiconductor AOI — 2/3 Sensor
16.2mm Bi-Telecentric Lens for PCB Instant Measurement — High Brightness, 1" Sensor