
“Silent Particles on the Chip, Unveiled Through the Lens in Every Detail.” - Chip Solder Joint Inspection
With the rapid development of semiconductor technology, chips are the core of modern electronic devices, and the quality of their solder joints directly affects product performance and lifespan. As chip integration increases and chip size decreases, the level of solder joint refinement intensifies.
Traditional inspection methods are unable to meet these stringent requirements, creating an urgent need for advanced, efficient, and accurate chip solder joint inspection technology and equipment.
In the inspection process, lens performance is critical. Canrill Optics specializes in high-precision inspection requirements, providing efficient and accurate solutions for this purpose.


Chip solder joint inspection requires precise identification of defects such as:
- Cold solder joints and bridging
- Poor soldering and morphology issues
- Accurate dimension and positioning verification
Lens: XF-10MDT1X178-1C
Camera: 1.1-inch, 2500-pixel, color camera
Illumination: 60° white ring light

The Canrill optical lens uses a 1x magnification, which accurately presents the true size of the chip solder joints and avoids errors caused by magnification or reduction of imaging.
Its high resolution and low distortion characteristics form a double guarantee: clearly capturing subtle bumps and details while ensuring the image is not distorted.
This helps inspection personnel accurately judge quality and provides strong support for improving chip manufacturing accuracy.

Established in 2009, Canrill was one of the first companies in China to develop and produce telecentric lenses. We operate our own optical processing, precision machining, and assembly plants.
Our products serve critical industries including semiconductors, display panels, lithium batteries, and high-speed inspection.
Canrill not only delivers premium products but marks the start of enhanced value-added services for you!

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